Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. - Gweltaz Gaudin; Gregory Riou; Didier Landru; Catherine Tempesta; Ionut Radu; Mariam Sadaka; Kevin Winstel; Emily Kinser; Robert Hannon (3DIC, 2010)

Pre bonding metrology solutions for 3D integration. - Gregory Riou; Gweltaz Gaudin; Didier Landru; Catherine Tempesta; Ionut Radu; Mariam Sadaka; Kevin Winstel; Emily Kinser; Robert Hannon; Boris V. Kamenev; Michael Darwin; Robert Sachs (3DIC, 2010)