Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. - Thomas Frank; Stéphane Moreau; Cédrick Chappaz; Patrick Leduc; Lucile Arnaud; Aurélie Thuaire; Emmanuel Chery; F. Lorut; Lorena Anghel; Gilles Poupon (Microelectron. Reliab., 2013)

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism. - Lin Hou; Emmanuel Chery; Kristof Croes; Davide Tierno; Soon Aik Chew; Yangyin Chen; Peter Rakbin; Eric Beyne (IRPS, 2022)

Assessment of critical Co electromigration parameters. - O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; Philippe J. Roussel; Marleen H. van der Veen; Veerle Simons; Emmanuel Chery; Ivan Ciofi; Kris Croes (IRPS, 2022)

Reliability Study of La- and Al-Doped ZrO2 Dielectrics for High Density MIMCAP Applications. - Emmanuel Chery; Lucie Sourgen; Jacopo Franco; Mihaela Ioana Popovici; Eric Beyne (IRPS, 2025)

Impact of Al-doping on Al: HfO2Dielectric Reliability in MIM Capacitors. - C. Fohn; F. Zharfan; Emmanuel Chery; Kris Croes; Michele Stucchi; V. Afanas'ev (IRPS, 2025)

Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps. - Alicja Lesniewska; Y. Fang; G. Delie; Philippe Roussel; Koen Van Sever; Emmanuel Chery; O. Varela Pedreira; Ivan Ciofi; S. H. Park; Zsolt Tokei; Kris Croes (IRPS, 2025)