Characterization method of thermomechanical parameters for microelectronic materials. - Oliver Perat; Jean-Marie Dorkel; Emmanuel Scheid; Pierre Temple-Boyer; Y. S. Chung; A. Peyre-Lavigne; M. Zecri; Patrick Tounsi (Microelectron. Reliab., 2002)

Characterization and modelling of ageing failures on power MOSFET devices. - B. Khong; Marc Legros; Patrick Tounsi; Philippe Dupuy; X. Chauffleur; Colette Levade; G. Vanderschaeve; Emmanuel Scheid (Microelectron. Reliab., 2007)

3D electro-thermal investigations for reliability of ultra low ON state resistance power MOSFET. - Jean-Baptiste Sauveplane; Patrick Tounsi; Emmanuel Scheid; A. Deram (Microelectron. Reliab., 2008)

Boron diffusion and activation in polysilicon multilayer films for P+ MOS structure: Characterization and modeling. - Ramdane Mahamdi; Laurent Saci; Farida Mansour; Pierre Temple-Boyer; Emmanuel Scheid; Laurent Jalabert (Microelectron. J., 2009)

On the accurate determination of the thermomechanical properties of micro-scale material: Application to AlSi1% chip metallization of a power semiconductor device. - Jean-Baptiste Sauveplane; Emmanuel Scheid; A. Deram (Microelectron. Reliab., 2009)