Coupled accelerated stress tests for comprehensive field reliability - Synergistic effects of moisture and temperature cycling. - Ankur Aggarwal; Enamul Kabir; David Huitink; Nipun Sinha; Emre Armagan; Keqin Cao (IRPS, 2015)

Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. - Chetan Prasad; Sunny Chugh; Hannes Greve; I-chen Ho; Enamul Kabir; Cheyun Lin; Mahjabin Maksud; Steven R. Novak; Benjamin Orr; Keun Woo Park; Anthony Schmitz; Zhizheng Zhang 006; et al. (IRPS, 2020)

A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability. - R. Aggarwal; L. Jiang; S. Patra; N. Lajo; Enamul Kabir; R. Kasim (IRPS, 2022)