Early evaluation techniques for low power binding. - Eren Kursun; Ankur Srivastava 001; Seda Ogrenci Memik; Majid Sarrafzadeh (ISLPED, 2002)

Predictability in RT-Level Designs. - Ankur Srivastava 001; Eren Kursun; Majid Sarrafzadeh (J. Circuits Syst. Comput., 2002)

Global resource sharing for synthesis of control data flow graphs on FPGAs. - Seda Ogrenci Memik; Gokhan Memik; Roozbeh Jafari; Eren Kursun (DAC, 2003)

Transistor Level Budgeting for Power Optimization. - Eren Kursun; Soheil Ghiasi; Majid Sarrafzadeh (ISQED, 2004)

Low-Overhead Core Swapping for Thermal Management. - Eren Kursun; Glenn Reinman; Suleyman Sair; Anahita Shayesteh; Timothy Sherwood (PACS, 2004)

Reducing the Latency and Area Cost of Core Swapping through Shared Helper Engines. - Anahita Shayesteh; Eren Kursun; Timothy Sherwood; Suleyman Sair; Glenn Reinman (ICCD, 2005)

Early Quality Assessment for Low Power Behavioral Synthesis. - Eren Kursun; Rajarshi Mukherjee; Seda Ogrenci Memik (J. Low Power Electron., 2005)

An Evaluation of Deeply Decoupled Cores. - Eren Kursun; Anahita Shayesteh; Suleyman Sair; Timothy Sherwood; Glenn Reinman (J. Instr. Level Parallelism, 2006)

Fine grain 3D integration for microarchitecture design through cube packing exploration. - Yongxiang Liu; Yuchun Ma; Eren Kursun; Glenn Reinman; Jason Cong (ICCD, 2007)

Variation-aware thermal characterization and management of multi-core architectures. - Eren Kursun; Chen-Yong Cher (ICCD, 2008)

Is 3D chip technology the next growth engine for performance improvement? - Philip G. Emma; Eren Kursun (IBM J. Res. Dev., 2008)

Investigating the effects of fine-grain three-dimensional integration on microarchitecture design. - Yuchun Ma; Yongxiang Liu; Eren Kursun; Glenn Reinman; Jason Cong (ACM J. Emerg. Technol. Comput. Syst., 2008)

Opportunities and Challenges for 3D Systems and Their Design. - Philip G. Emma; Eren Kursun (IEEE Des. Test Comput., 2009)

Temperature Variation Characterization and Thermal Management of Multicore Architectures. - Eren Kursun; Chen-Yong Cher (IEEE Micro, 2009)

Power and thermal characterization of POWER6 system. - Víctor Jiménez; Francisco J. Cazorla; Roberto Gioiosa; Mateo Valero; Carlos Boneti; Eren Kursun; Chen-Yong Cher; Canturk Isci; Alper Buyuktosunoglu; Pradip Bose (PACT, 2010)

Power-efficient, reliable microprocessor architectures: modeling and design methods. - Pradip Bose; Alper Buyuktosunoglu; Chen-Yong Cher; John A. Darringer; Meeta Sharma Gupta; Hendrik F. Hamann; Hans M. Jacobson; Prabhakar Kudva; Eren Kursun; Niti Madan; Indira Nair; Jude A. Rivers; et al. (ACM Great Lakes Symposium on VLSI, 2010)

Trends and techniques for energy efficient architectures. - Víctor Jiménez; Roberto Gioiosa; Eren Kursun; Francisco J. Cazorla; Chen-Yong Cher; Alper Buyuktosunoglu; Pradip Bose; Mateo Valero (VLSI-SoC, 2010)

Design, CAD and technology challenges for future processors: 3D perspectives. - Jeff Burns; Gary Carpenter; Eren Kursun; Ruchir Puri; James D. Warnock; Michael Scheuermann (DAC, 2011)

Exploring the vulnerability of CMPs to soft errors with 3D stacked non-volatile memory. - Guangyu Sun 003; Eren Kursun; Jude A. Rivers; Yuan Xie 001 (ICCD, 2011)

Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs. - Yibo Chen; Eren Kursun; Dave Motschman; Charles Johnson; Yuan Xie 001 (ISLPED, 2011)

Characterizing Power and Temperature Behavior of POWER6-Based System. - Víctor Jiménez; Francisco J. Cazorla; Roberto Gioiosa; Mateo Valero; Carlos Boneti; Eren Kursun; Chen-Yong Cher; Canturk Isci; Alper Buyuktosunoglu; Pradip Bose (IEEE J. Emerg. Sel. Topics Circuits Syst., 2011)

Energy-Aware Accounting and Billing in Large-Scale Computing Facilities. - Víctor Jiménez; Francisco J. Cazorla; Roberto Gioiosa; Eren Kursun; Canturk Isci; Alper Buyuktosunoglu; Pradip Bose; Mateo Valero (IEEE Micro, 2011)

Exploring the effects of on-chip thermal variation on high-performance multicore architectures. - Chen-Yong Cher; Eren Kursun (ACM Trans. Archit. Code Optim., 2011)

An information-theoretic framework for optimal temperature sensor allocation and full-chip thermal monitoring. - Huapeng Zhou; Xin Li 001; Chen-Yong Cher; Eren Kursun; Haifeng Qian; Shi-Chune Yao (DAC, 2012)

Spatial and temporal thermal characterization of stacked multicore architectures. - Eren Kursun; Jamil A. Wakil; Mukta Farooq; Robert Hannon (ACM J. Emerg. Technol. Comput. Syst., 2012)

Fast poisson solvers for thermal analysis. - Haifeng Qian; Sachin S. Sapatnekar; Eren Kursun (ACM Trans. Design Autom. Electr. Syst., 2012)

Thermomechanical stress-aware management for 3D IC designs. - Qiaosha Zou; Tao Zhang 032; Eren Kursun; Yuan Xie 001 (DATE, 2013)

Exploring the vulnerability of CMPs to soft errors with 3D stacked nonvolatile memory. - Guangyu Sun 003; Eren Kursun; Jude A. Rivers; Yuan Xie 001 (ACM J. Emerg. Technol. Comput. Syst., 2013)

Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits. - Yibo Chen; Eren Kursun; Dave Motschman; Charles Johnson; Yuan Xie 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013)

3D stacking of high-performance processors. - Philip G. Emma; Alper Buyuktosunoglu; Michael B. Healy; Krishnan Kailas; Valentin Puente; Roy Yu; Allan Hartstein; Pradip Bose; Jaime H. Moreno; Eren Kursun (HPCA, 2014)

Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges. - Peng Gu; Shuangchen Li; Dylan C. Stow; Russell Barnes; Liu Liu 017; Yuan Xie 001; Eren Kursun (ACM Great Lakes Symposium on VLSI, 2016)

Thermal-aware 3D design for side-channel information leakage. - Peng Gu; Dylan C. Stow; Russell Barnes; Eren Kursun; Yuan Xie 001 (ICCD, 2016)

Security Threats and Countermeasures in Three-Dimensional Integrated Circuits. - Jaya Dofe; Peng Gu; Dylan C. Stow; Qiaoyan Yu; Eren Kursun; Yuan Xie 001 (ACM Great Lakes Symposium on VLSI, 2017)

Hotspot monitoring and Temperature Estimation with miniature on-chip temperature sensors. - Pavan Kumar Chundi; Yini Zhou; Martha A. Kim; Eren Kursun; Mingoo Seok (ISLPED, 2017)

Compact and voltage-scalable sensor for accurate thermal sensing in dynamic thermal management. - Teng Yang; Pavan Kumar Chundi; Seongjong Kim; Eren Kursun; Martha A. Kim; Peter R. Kinget; Mingoo Seok (MWSCAS, 2017)

Editorial. - Krishnendu Chakrabarty; Massimo Alioto; Bevan M. Baas; Chirn Chye Boon; Meng-Fan Chang; Naehyuck Chang; Yao-Wen Chang; Chip-Hong Chang; Shih-Chieh Chang; Poki Chen; Masud H. Chowdhury; Pasquale Corsonello; et al. (IEEE Trans. Very Large Scale Integr. Syst., 2017)

Thermomechanical Stress-Aware Management for 3-D IC Designs. - Qiaosha Zou; Eren Kursun; Yuan Xie 001 (IEEE Trans. Very Large Scale Integr. Syst., 2017)

Label Augmentation via Time-based Knowledge Distillation for Financial Anomaly Detection. - Hongda Shen; Eren Kursun (CoRR, 2021)