MOBILE: User-Centered Interface Building. - Angel R. Puerta; Eric Cheng; Tunhow Ou; Justin Min (CHI, 1999)

Abstract factories and the shape calculator. - Eric Cheng; Dung Zung Nguyen; Mathias Ricken; Stephen B. Wong (OOPSLA Companion, 2004)

Marine biology simulation. - Eric Cheng; Dung Zung Nguyen; Mathias Ricken; Stephen B. Wong (OOPSLA Companion, 2004)

Causal commutative arrows and their optimization. - Hai Liu 012; Eric Cheng; Paul Hudak (ICFP, 2009)

Causal commutative arrows. - Hai Liu 012; Eric Cheng; Paul Hudak (J. Funct. Program., 2011)

Self-repair of uncore components in robust system-on-chips: An OpenSPARC T2 case study. - Yanjing Li; Eric Cheng; Samy Makar; Subhasish Mitra (ITC, 2013)

Developing a Knowledge Base for Detecting Carotid Stenosis with pyConText. - Danielle L. Mowery; Daniel Franc; Shazia Ashfaq; Eric Cheng; Tania Zamora; Wendy W. Chapman; Brian E. Chapman (AMIA, 2014)

The resilience wall: Cross-layer solution strategies. - Subhasish Mitra; Pradip Bose; Eric Cheng; Chen-Yong Cher; Hyungmin Cho; Rajiv V. Joshi; Young Moon Kim; Charles R. Lefurgy; Yanjing Li; Kenneth P. Rodbell; Kevin Skadron; James H. Stathis; et al. (VLSI-DAT, 2014)

Clear: cross-layer exploration for architecting resilience combining hardware and software techniques to tolerate soft errors in processor cores. - Eric Cheng; Shahrzad Mirkhani; Lukasz G. Szafaryn; Chen-Yong Cher; Hyungmin Cho; Kevin Skadron; Mircea R. Stan; Klas Lilja; Jacob A. Abraham; Pradip Bose; Subhasish Mitra (DAC, 2016)

Very Low Voltage (VLV) Design. - Ramon Bertran; Pradip Bose; David M. Brooks; Jeff Burns; Alper Buyuktosunoglu; Nandhini Chandramoorthy; Eric Cheng; Martin Cochet; Schuyler Eldridge; Daniel Friedman; Hans M. Jacobson; Rajiv V. Joshi; et al. (ICCD, 2017)

Cross-Layer Resilience in Low-Voltage Digital Systems: Key Insights. - Eric Cheng; Jacob A. Abraham; Pradip Bose; Alper Buyuktosunoglu; Keith A. Campbell; Deming Chen; Chen-Yong Cher; Hyungmin Cho; Binh Q. Le; Klas Lilja; Shahrzad Mirkhani; Kevin Skadron; et al. (ICCD, 2017)

System-Level Effects of Soft Errors in Uncore Components. - Hyungmin Cho; Eric Cheng; Thomas Shepherd; Chen-Yong Cher; Subhasish Mitra (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017)

ETISS-ML: A multi-level instruction set simulator with RTL-level fault injection support for the evaluation of cross-layer resiliency techniques. - Daniel Mueller-Gritschneder; Martin Dittrich; Josef Weinzierl; Eric Cheng; Subhasish Mitra; Ulf Schlichtmann (DATE, 2018)

Tolerating Soft Errors in Processor Cores Using CLEAR (Cross-Layer Exploration for Architecting Resilience). - Eric Cheng; Shahrzad Mirkhani; Lukasz G. Szafaryn; Chen-Yong Cher; Hyungmin Cho; Kevin Skadron; Mircea R. Stan; Klas Lilja; Jacob A. Abraham; Pradip Bose; Subhasish Mitra (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018)

Cross-Layer Resilience: Challenges, Insights, and the Road Ahead. - Eric Cheng; Daniel Mueller-Gritschneder; Jacob A. Abraham; Pradip Bose; Alper Buyuktosunoglu; Deming Chen; Hyungmin Cho; Yanjing Li; Uzair Sharif; Kevin Skadron; Mircea Stan; Ulf Schlichtmann; et al. (DAC, 2019)

Rebuilding Notre Dame: A VR documentary produced by TARGO in partnership with Facebook's Oculus. - Chloé Rochereuil; Victor Agulhon; Eric Cheng (SIGGRAPH Asia XR, 2020)

Noninterruptive Clinical Decision Support Decreases Ordering of Respiratory Viral Panels during Influenza Season. - Cameron Escovedo; Douglas S. Bell; Eric Cheng; Omai Garner; Alyssa Ziman; Sitaram Vangala; Prabhu Gounder; Carlos F. Lerner (Appl. Clin. Inform., 2020)

Project 38: Innovative Architectures for High-Performance Computing Systems. - Eric Cheng (IA3@SC, 2021)

Traffic Control via Connected and Automated Vehicles: An Open-Road Field Experiment with 100 CAVs. - Jonathan W. Lee; Han Wang 024; Kathy Jang; Amaury Hayat; Matthew R. Bunting; Arwa Alanqary; William Barbour; Zhe Fu; Xiaoqian Gong; George Gunter; Sharon Hornstein; Abdul Rahman Kreidieh; et al. (CoRR, 2024)

CLEAR Cross-Layer Resilience: A Retrospective. - Eric Cheng; Hyungmin Cho; Shahrzad Mirkhani; Lukasz G. Szafaryn; Jacob A. Abraham; Pradip Bose; Chen-Yong Cher; Klas Lilja; Kevin Skadron; Mircea Stan; Subhasish Mitra (IEEE Des. Test, 2025)