Impact life prediction modeling of TFBGA packages under board level drop test. - Tong Yan Tee; Hun Shen Ng; Chwee Teck Lim; Eric Pek; Zhaowei Zhong (Microelectron. Reliab., 2004)

Dynamic responses and solder joint reliability under board level drop test. - Jing-en Luan; Tong Yan Tee; Eric Pek; Chwee Teck Lim; Zhaowei Zhong (Microelectron. Reliab., 2007)