Design and Development of New Robust 3.3kV IGBT and FWD Module Chips. - John F. Donlon; Eric R. Motto; Shinichi Iura (IAS, 2007)

A Monolithic 500V, 1A Three Phase Motor Driver with Small Outline Surface Mount Package. - Eric R. Motto; John F. Donlon; K. Watabe; H. Kazunari; T. Araki (IAS, 2007)

Chip Improvements for Future IGBT Modules. - John F. Donlon; Eric R. Motto; Tetsuo Takahashi; Hidenori Fujii; Katsumi Satoh (IAS, 2008)

Large Package Transfer Molded DIP-IPM. - Eric R. Motto; John F. Donlon; Ming Shang; Kazuhiro Kuriaki; Toru Iwagami; Hisashi Kawafuji; Toshiya Nakano (IAS, 2008)