Thermal Modeling and Management Challenges in Heterogenous Integration: 2.5D Chiplet Platforms and Beyond. - Jaehyun Park 005; Alish Kanani; Lukas Pfromm; Harsh Sharma; Parth Solanki; Eric Tervo; Janardhan Rao Doppa; Partha Pratim Pande; Ümit Y. Ogras (VTS, 2024)

MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures. - Lukas Pfromm; Alish Kanani; Harsh Sharma; Parth Solanki; Eric Tervo; Jaehyun Park 005; Janardhan Rao Doppa; Partha Pratim Pande; Ümit Y. Ogras (CoRR, 2024)