Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs. - Stephane Azzopardi; Atsuo Kawamura; Hideo Iwamoto; Olivier Briat; Jean-Michel Vinassa; Eric Woirgard; Christian Zardini (Microelectron. Reliab., 2001)

Evaluation of lead-free soldering for automotive applications. - Alexandrine Guédon; Eric Woirgard; Christian Zardini (Microelectron. Reliab., 2002)

Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations. - P. Guilbault; Eric Woirgard; Christian Zardini; D. Lambert (Microelectron. Reliab., 2002)

IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? - Stephane Azzopardi; Eric Woirgard; Jean-Michel Vinassa; Olivier Briat; Christian Zardini (Microelectron. Reliab., 2003)

Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant. - Alexandrine Guédon; Eric Woirgard; Christian Zardini; Guillaume Simon (Microelectron. Reliab., 2003)

Influence of the thermo-mechanical residual state on the power assembly modellization. - Alexandrine Guédon-Gracia; Pascal Roux; Eric Woirgard; Christian Zardini (Microelectron. Reliab., 2004)

Assessment of the Trench IGBT reliability: low temperature experimental characterization. - Stephane Azzopardi; A. Benmansour; M. Ishiko; Eric Woirgard (Microelectron. Reliab., 2005)

Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. - Alexandrine Guédon-Gracia; Eric Woirgard; Christian Zardini (Microelectron. Reliab., 2005)

Specification and use of pulsed current profiles for ultracapacitors power cycling. - Walid Lajnef; Jean-Michel Vinassa; Olivier Briat; Eric Woirgard (Microelectron. Reliab., 2005)

Failure mechanism of trench IGBT under short-circuit after turn-off. - Adel Benmansour; Stephane Azzopardi; Jean-Christophe Martin; Eric Woirgard (Microelectron. Reliab., 2006)

Power cycling tests for accelerated ageing of ultracapacitors. - Olivier Briat; Walid Lajnef; Jean-Michel Vinassa; Eric Woirgard (Microelectron. Reliab., 2006)

Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions. - Adel Benmansour; Stephane Azzopardi; Jean-Christophe Martin; Eric Woirgard (Microelectron. Reliab., 2007)

A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation. - Adel Benmansour; Stephane Azzopardi; Jean-Christophe Martin; Eric Woirgard (Microelectron. Reliab., 2007)

Monitoring fading rate of ultracapacitors using online characterization during power cycling. - Walid Lajnef; Jean-Michel Vinassa; Olivier Briat; H. El Brouji; Eric Woirgard (Microelectron. Reliab., 2007)

Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests. - H. El Brouji; Olivier Briat; Jean-Michel Vinassa; Nicolas Bertrand; Eric Woirgard (Microelectron. Reliab., 2008)

Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation. - Yassine Belmehdi; Stephane Azzopardi; A. Benmansour; Jean-Yves Delétage; Eric Woirgard (Microelectron. Reliab., 2009)

Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions. - H. El Brouji; Olivier Briat; Jean-Michel Vinassa; Hervé Henry; Eric Woirgard (Microelectron. Reliab., 2009)

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. - Alexandre Micol; A. Zeanh; T. Lhommeau; Stephane Azzopardi; Eric Woirgard; Olivier Dalverny; Moussa Karama (Microelectron. Reliab., 2009)

Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance. - E.-Hassane El Brouji; Olivier Briat; Jean-Michel Vinassa; Nicolas Bertrand; Eric Woirgard (IEEE Trans. Veh. Technol., 2009)

Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature. - Yassine Belmehdi; Stephane Azzopardi; Jean-Yves Delétage; Eric Woirgard (Microelectron. Reliab., 2010)

Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling. - Olivier Briat; Jean-Michel Vinassa; Nicolas Bertrand; H. El Brouji; Jean-Yves Delétage; Eric Woirgard (Microelectron. Reliab., 2010)

How supercapacitors reach end of life criteria during calendar life and power cycling tests. - Ramzi Chaari; Olivier Briat; Jean-Yves Delétage; Eric Woirgard; Jean-Michel Vinassa (Microelectron. Reliab., 2011)

Ageing monitoring of lithium-ion cell during power cycling tests. - Akram Eddahech; Olivier Briat; Hervé Henry; Jean-Yves Delétage; Eric Woirgard; Jean-Michel Vinassa (Microelectron. Reliab., 2011)

Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications. - Akram Eddahech; Olivier Briat; Eric Woirgard; Jean-Michel Vinassa (Microelectron. Reliab., 2012)

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization. - François Le Henaff; Stephane Azzopardi; Jean-Yves Delétage; Eric Woirgard; Serge Bontemps; Julien Joguet (Microelectron. Reliab., 2012)

Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach. - F. Baccar; Stephane Azzopardi; L. Théolier; K. El Boubkari; Jean-Yves Delétage; Eric Woirgard (Microelectron. Reliab., 2013)

Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. - Wissam Sabbah; Stephane Azzopardi; Cyril Buttay; Régis Meuret; Eric Woirgard (Microelectron. Reliab., 2013)

Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material. - Houssam Arbess; F. Baccar; L. Théolier; Stephane Azzopardi; Eric Woirgard (Microelectron. Reliab., 2015)

Ageing mechanisms in Deep Trench Termination (DT2) Diode. - F. Baccar; Houssam Arbess; L. Théolier; Stephane Azzopardi; Eric Woirgard (Microelectron. Reliab., 2015)

Identification and analysis of power substrates degradations subjected to severe aging tests. - Eric Woirgard; Faical Arabi; Wissam Sabbah; Donatien Martineau; L. Théolier; Stephane Azzopardi (Microelectron. Reliab., 2015)

Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. - Toni Youssef; W. Rmili; Eric Woirgard; Stephane Azzopardi; N. Vivet; D. M. Meekhof; Régis Meuret; G. Le Quilliec; C. Richard (Microelectron. Reliab., 2015)

Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices. - Faical Arabi; Loic Théolier; Donatien Martineau; Jean-Yves Delétage; M. Medina; Eric Woirgard (Microelectron. Reliab., 2016)

Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering. - Maxime Barrière; Alexandrine Guédon-Gracia; Eric Woirgard; Serge Bontemps; François Le Henaff (Microelectron. Reliab., 2017)

Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs. - Omar Chihani; Loic Théolier; Jean-Yves Delétage; Eric Woirgard; Alain Bensoussan 002; André Durier (IRPS, 2018)

Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses. - Omar Chihani; L. Théolier; Alain Bensoussan 002; Jean-Yves Delétage; André Durier; Eric Woirgard (Microelectron. Reliab., 2018)