Reliability-aware floorplanning for 3D circuits. - Jacob R. Minz; Eric Wong 002; Sung Kyu Lim (SoCC, 2005)

3D floorplanning with thermal vias. - Eric Wong 002; Sung Kyu Lim (DATE, 2006)

Multi-Objective Module Placement For 3-D System-On-Package. - Eric Wong 002; Jacob R. Minz; Sung Kyu Lim (IEEE Trans. Very Large Scale Integr. Syst., 2006)

Whitespace redistribution for thermal via insertion in 3D stacked ICs. - Eric Wong 002; Sung Kyu Lim (ICCD, 2007)

Decoupling-Capacitor Planning and Sizing for Noise and Leakage Reduction. - Eric Wong 002; Jacob R. Minz; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2007)