3D Capacitive Interconnections for High Speed Interchip Communication. - Roberto Canegallo; Alberto Fazzi; Luca Ciccarelli; Luca Magagni; Federico Natali; Pier Luigi Rolandi; Erik Jung; Léa Di Cioccio; Roberto Guerrieri (CICC, 2007)

3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities. - Alberto Fazzi; Roberto Canegallo; Luca Ciccarelli; Luca Magagni; Federico Natali; Erik Jung; Pier Luigi Rolandi; Roberto Guerrieri (ISSCC, 2007)

3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. - Alberto Fazzi; Luca Magagni; Mauro Mirandola; Barbara Charlet; Léa Di Cioccio; Erik Jung; Roberto Canegallo; Roberto Guerrieri (IEEE J. Solid State Circuits, 2007)

Lamination And Microstructuring Technology for a Bio-Cell Multiwell array - Erik Jung; Dionysios Manessis; Alexander Neumann 002; Lars Böttcher; Tanja Braun; Jörg Bauer 002; Herbert Reichl; Bruno Iafelice; Federica Destro; Roberto Gambari (CoRR, 2008)

3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities. - Alberto Fazzi; Roberto Canegallo; Luca Ciccarelli; Luca Magagni; Federico Natali; Erik Jung; Pier Luigi Rolandi; Roberto Guerrieri (IEEE J. Solid State Circuits, 2008)

A light-weight, multi-axis compliant tensegrity joint. - Steven Lessard; Jonathan Bruce; Erik Jung; Mircea Teodorescu; Vytas SunSpiral; Adrian K. Agogino (CoRR, 2015)

A lightweight, multi-axis compliant tensegrity joint. - Steven Lessard; Jonathan Bruce; Erik Jung; Mircea Teodorescu; Vytas SunSpiral; Adrian K. Agogino (ICRA, 2016)

Bio-Inspired Tensegrity Flexural Joints. - Erik Jung; Victoria Ly; Nicholas Cessna; Mai Linh Ngo; Dennis Castro; Vytas SunSpiral; Mircea Teodorescu (ICRA, 2018)

Design and Selection of Muscle Excitation Patterns for Modeling a Lower Extremity Joint Inspired Tensegrity. - Erik Jung; Victoria Ly; Adam Buderi; Emma Appleton; Mircea Teodorescu (IRC, 2019)