Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs. - Erping Deng; Zhibin Zhao; Qingming Xin; Jingwei Zhang; Yongzhang Huang (Microelectron. Reliab., 2017)

Optimization of the thermal contact resistance within press pack IGBTs. - Erping Deng; Zhibin Zhao; Peng Zhang; Yongzhang Huang; Jinyuan Li (Microelectron. Reliab., 2017)

Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs. - Erping Deng; Zhibin Zhao; Peng Zhang; Jinyuan Li; Yongzhang Huang (Microelectron. Reliab., 2017)

Method of Turns Arrangement of Noncircular Rogowski Coil With Rectangular Section. - Shi Fu; Erping Deng; Cheng Peng 017; Guanrou Zhang; Zhibin Zhao; Xiang Cui (IEEE Trans. Instrum. Meas., 2021)