Reticle Enhancement Technology: Implications and Challenges for Physical Design. - Warren Grobman; Matt Thompson; Ruoping Wang; Chi-Min Yuan; Ruiqi Tian; Ertugrul Demircan (DAC, 2001)

Effects of Interconnect Process Variations on Signal Integrity. - Ertugrul Demircan (SoCC, 2006)

Voltage-based electromigration immortality check for general multi-branch interconnects. - Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Taeyoung Kim 001; Xin Huang 003; Sheldon X.-D. Tan (ICCAD, 2016)

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. - Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Chase Cook; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018)

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. - Chase Cook; Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2018)

Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis. - Shaoyi Peng; Ertugrul Demircan; Mehul D. Shroff; Sheldon X.-D. Tan (Integr., 2020)