Design Considerations and Benefits of Three-Dimensional Ternary Content Addressable Memory. - Eun Chu Oh; Paul D. Franzon (CICC, 2007)

Design and CAD for 3D integrated circuits. - Paul D. Franzon; W. Rhett Davis; Michael B. Steer; Steve Lipa; Eun Chu Oh; Thorlindur Thorolfsson; Samson Melamed; Sonali Luniya; Tad Doxsee; Stephen Berkeley; Ben Shani; Kurt Obermiller (DAC, 2008)

Technology impact analysis for 3D TCAM. - Eun Chu Oh; Paul D. Franzon (3DIC, 2009)

Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies. - William Rhett Davis; Eun Chu Oh; Ambarish M. Sule; Paul D. Franzon (IEEE Trans. Very Large Scale Integr. Syst., 2009)