In-situ Monitoring Hydrodynamic Pressure Distribution during Chemical Mechanical Polishing. - Eungchul Kim; Gunhoo Woo; Taesung Kim (MetroInd4.0&IoT, 2019)

Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer in sub-Micron Scale. - Eungchul Kim; Seungjun Oh; Taesung Kim (MetroInd4.0&IoT, 2021)