Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs. - Seongkyung Kim; Hyerim Park; Eunyu Choi; Young Han Kim; Dahyub Kim; Hyewon Shim; Shin-Young Chung; Paul Jung (IRPS, 2023)

Hot-Carrier-Degradation Characterization for Accurate End-of-Life Prediction with 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FET. - Seongkyung Kim; Junkyo Jeong; Eunyu Choi; Jinyoung Kim; Hyewon Shim; Shin-Young Chung; Paul Jung (VLSI Technology and Circuits, 2024)

Reliability Impacts of Tapered Nanosheets and Localized Layout Effects in MBCFETs Fabricated with 2NM Logic Technology Featuring GAA. - Seongkyung Kim; Eunyu Choi; Jinyoung Kim; Junkyo Jeong; Jihun Ryu; Myungsoo Yeo; Taiki Uemura; Shin-Young Chung; Jong-Ho Lee (IRPS, 2025)