Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process. - C. Y. Khor; M. Abdul Mujeebu; Mohd Zulkifly Abdullah; F. Che Ani (Microelectron. Reliab., 2010)

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. - Chun-Sean Lau; Mohd Zulkifly Abdullah; F. Che Ani (Microelectron. Reliab., 2012)

Lattice Boltzmann method study of bga bump arrangements on void formation. - Aizat Abas; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; F. Che Ani; Soon Fuat Khor (Microelectron. Reliab., 2016)

Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. - M. S. Haslinda; Aizat Abas; F. Che Ani; A. Jalar; Abdullah Aziz Saad; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2017)

Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. - A. M. Najib; Mohd Zulkifly Abdullah; Abdullah Aziz Saad; Z. Samsudin; F. Che Ani (Microelectron. Reliab., 2017)

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. - Fei Chong Ng; Aizat Abas; Z. L. Gan; Mohd Zulkifly Abdullah; F. Che Ani; M. Yusuf Tura Ali (Microelectron. Reliab., 2017)