Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. - Yann Civale; Deniz Sabuncuoglu Tezcan; Harold G. G. Philipsen; P. Jaenen; Rahul Agarwal; F. Duval; Philippe Soussan; Youssef Travaly; Eric Beyne (3DIC, 2009)