Low temperature direct bonding: An attractive technique for heterostructures build-up. - H. Moriceau; F. Rieutord; F. Fournel; Léa Di Cioccio; C. Moulet; Luc Libralesso; Pierric Gueguen; Rachid Taibi; C. Deguet (Microelectron. Reliab., 2012)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IRPS, 2018)

Engineered SiC materials for power technologies. - Walter Schwarzenbach; S. Rouchier; G. Berre; R. Boulet; O. Ledoux; Enrica Cela; Alexis Drouin; A. Chapelle; S. Monnoye; H. Biard; K. Alassaad; L. Viravaux; et al. (ICICDT, 2022)