Wafer Bonding Process Based On The Taguchi Analysis. - Jun Wei 003; F. L. Ng; M. L. Nai; H. Xie; Peck Cheng Lim; C. K. Wong (Int. J. Comput. Eng. Sci., 2003)

Inspection and Image Analysis of Nickel Sulphide Inclusions in Toughened Glass Panels. - X. Li; Z. P. Fang; F. L. Ng; L. P. Zhao; L. Zhao (ICARCV, 2006)

The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. - C. K. Wong; John H. L. Pang; J. W. Tew; B. K. Lok; H. J. Lu; F. L. Ng; Y. F. Sun (Microelectron. Reliab., 2008)