Comparing drop impact test method using strain gauge measurements. - Y. Liu; F. J. H. G. Kessels; Willem D. van Driel; J. A. S. van Driel; F. L. Sun; G. Q. Zhang (Microelectron. Reliab., 2009)

Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading. - H. W. Zhang; Yang Liu 103; J. Wang; F. L. Sun (Microelectron. Reliab., 2015)

Fast direct isogeometric boundary element method for 3D potential problems based on HODLR matrix. - F. L. Sun; Chunying Dong; Yihao Wu; Yanpeng Gong (Appl. Math. Comput., 2019)

A novel fast direct solver for 3D elastic inclusion problems with the isogeometric boundary element method. - F. L. Sun; Yanpeng Gong; Chunying Dong (J. Comput. Appl. Math., 2020)

Isogeometric symmetric FE-BE coupling method for acoustic-structural interaction. - Yihao Wu; Chunying Dong; Huashi Yang; F. L. Sun (Appl. Math. Comput., 2021)