Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact. - F. L. T. Maggioni; Herman Oprins; Eric Beyne; Ingrid De Wolf; Martine Baelmans (Microelectron. J., 2014)

Thermal experimental and modeling analysis of high power 3D packages. - Herman Oprins; Vladimir Cherman; Geert Van der Plas; F. L. T. Maggioni; Joeri De Vos; Eric Beyne (ICICDT, 2015)

New fast distributed thermal model for analysis of GaN based power devices. - Vice Sodan; Federica Lidia Teresa Maggioni; Herman Oprins; Steve Stoffels; Martine Baelmans; Ingrid De Wolf (ESSDERC, 2016)