Impact of a 10nm Ultra-Thin BOX (UTBOX) and Ground Plane on FDSOI devices for 32nm node and below. - Claire Fenouillet-Béranger; P. Perreau; S. Denorme; L. Tosti; François Andrieu; Olivier Weber; S. Barnola; C. Arvet; Y. Campidelli; Sébastien Haendler; R. Beneyton; C. Perrot; et al. (ESSCIRC, 2009)

3D integration demonstration of a wireless product with design partitioning. - G. Druais; Pascal Ancey; C. Aumont; V. Caubet; Laurent-Luc Chapelon; C. Chaton; Séverine Cheramy; S. Cordova; E. Cirot; Jean-Philippe Colonna; Perceval Coudrain; T. Divel; et al. (3DIC, 2011)