Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. - Toshitaka Ishizaki; T. Satoh; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2013)

Reliability of Cu nanoparticle joint for high temperature power electronics. - Toshitaka Ishizaki; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; T. Satoh; Yasushi Yamada (Microelectron. Reliab., 2014)

Thermal simulation of joints with high thermal conductivities for power electronic devices. - Toshitaka Ishizaki; Masashi Yanase; A. Kuno; T. Satoh; Masanori Usui; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2015)

MN-Core - A Highly Efficient and Scalable Approach to Deep Learning. - Ken Namura; Johannes Maximilian Kühn; Tohru Adachi; H. Imachi; H. Kaneko; T. Kato; Go Watanabe; Naoto Tanaka; S. Kashihara; Hiroshi Miyashita; Y. Tomonaga; Ryosuke Okuta; et al. (VLSI Circuits, 2021)