Reliability of high temperature solder alternatives. - F. Patrick McCluskey; M. Dash; Z. Wang; D. Huff (Microelectron. Reliab., 2006)

Eliminating infant mortality in metallized film capacitors by defect detection. - F. Patrick McCluskey; N. M. Li; Elena Mengotti (Microelectron. Reliab., 2014)

Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications. - Pedro Quintero; F. Patrick McCluskey; B. Koene (Microelectron. Reliab., 2014)

Physics-of-failure assessment methodology for power electronic systems. - David Squiller; Hannes Greve; Elena Mengotti; F. Patrick McCluskey (Microelectron. Reliab., 2014)

Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs). - Nga Man Li; Subramani Manoharan; Diganta Das; F. Patrick McCluskey (Microelectron. Reliab., 2018)

Mechanism of wire bond shear testing. - Subramani Manoharan; Chandradip Patel; Stevan Hunter; F. Patrick McCluskey (Microelectron. Reliab., 2018)

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. - Subramani Manoharan; Chandradip Patel; F. Patrick McCluskey; Michael G. Pecht (Microelectron. Reliab., 2018)

Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications. - Shuji Nishimoto; Seyed Ali Moeini; Toyo Ohashi; Yoshiyuki Nagatomo; F. Patrick McCluskey (Microelectron. Reliab., 2018)