Analysing Particle Jets with Artificial Neural Networks. - Karl-Heinz Becks; J. Dahm; F. Seidel (IEA/AIE, 1992)

Lowest IOFF < 3×10-21 A/μm in capacitorless DRAM achieved by Reactive Ion Etch of IGZO-TFT. - Attilio Belmonte; Shreya Kundu; S. Subhechha; Adrian Vaisman Chasin; Nouredine Rassoul; Harold Dekkers; H. Puliyalil; F. Seidel; P. Carolan; Romain Delhougne; Gouri Sankar Kar (VLSI Technology and Circuits, 2023)

Nanosheet-based Complementary Field-Effect Transistors (CFETs) at 48nm Gate Pitch, and Middle Dielectric Isolation to enable CFET Inner Spacer Formation and Multi-Vt Patterning. - Hans Mertens; M. Hosseini; Thomas Chiarella; D. Zhou; S. Wang; G. Mannaert; E. Dupuy; D. Radisic; Z. Tao; Yusuke Oniki; Andriy Hikavyy; R. Rosseel; et al. (VLSI Technology and Circuits, 2023)

Hole-Side Airgap Integration as Enabler for 3D NAND Flash Z-Pitch Scaling. - S. Rachidi; S. Ramesh; Devin Verreck; J. Loyo; Y. Jeong; H. Puliyalil; Jie Li; F. Seidel; Geert Van Den Bosch; Maarten Rosmeulen (IMW, 2025)