True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines. - Graziella Scandurra; Carmine Ciofi; Calogero Pace; F. Speroni; F. Alagi (Microelectron. Reliab., 2002)

Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections. - A. Andreini; C. Neva; L. Renard; G. Sironi; F. Speroni; Luca Sponton; F. Tampellini; R. Tiziani (Microelectron. Reliab., 2003)

Modeling the Temperature Dependence of TDDB in Galvanic Isolators Based on Polymeric Dielectrics. - J. L. Mazzola; M. Greatti; C. Monzio Compagnoni; Alessandro S. Spinelli; V. Marano; M. Lauria; D. Paci; F. Speroni; Gerardo Malavena (ESSDERC, 2023)

Investigation of the Moisture- Driven Dynamics of Time- Dependent Dielectric Breakdown in Polymeric Dielectrics for Galvanic Isolators. - M. Greatti; J. L. Mazzola; C. Monzio Compagnoni; Alessandro S. Spinelli; D. Paci; F. Speroni; V. Marano; M. Lauria; Gerardo Malavena (IRPS, 2024)

Current Dynamics during Bipolar TDDB in Galvanic Isolators based on Polymeric Dielectrics. - M. Greatti; J. L. Mazzola; P. Vogler; C. Monzio Compagnoni; Alessandro S. Spinelli; D. Paci; F. Speroni; D. Asnaghi; M. Salina; F. Guzzi; M. Lauria; V. Marano; et al. (IRPS, 2025)