Reliability of Wafer Level Chip Scale Packages. - R. T. H. Rongen; R. Roucou; P. J. vd Wel; F. C. Voogt; F. Swartjes; Kirsten Weide-Zaage (Microelectron. Reliab., 2014)

Moisture absorption and desorption in wafer level chip scale packages. - Kirsten Rongen; Amar Mavinkurve; M. Chen; P. J. van der Wel; F. Swartjes; Rene T. H. Rongen (Microelectron. Reliab., 2015)