Drop impact reliability testing for lead-free and lead-based soldered IC packages. - Desmond Y. R. Chong; F. X. Che; John H. L. Pang; Kellin Ng; Jane Y. N. Tan; Patrick T. H. Low (Microelectron. Reliab., 2006)

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. - Yuqi Wang; K. H. Low; John H. L. Pang; Kay Hiang Hoon; F. X. Che; Y. S. Yong (Microelectron. Reliab., 2006)

Vibration reliability test and finite element analysis for flip chip solder joints. - F. X. Che; John H. L. Pang (Microelectron. Reliab., 2009)

A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. - Xiaowu Zhang; Ranjan Rajoo; F. X. Che; C. S. Selvanayagam; W. K. Choi; Shan Gao; Guo-Qiang Lo; Dim-Lee Kwong (3DIC, 2011)

Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods. - Hongbin Shi; F. X. Che; Cuihua Tian; Rui Zhang; Jong Tae Park 003; Toshitsugu Ueda (Microelectron. Reliab., 2012)

Study on reliability of PQFP assembly with lead free solder joints under random vibration test. - F. X. Che; John H. L. Pang (Microelectron. Reliab., 2015)