Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). - Fa Xing Che; Wahyuaji Narottama Putra; A. Heryanto; A. Trigg; S. Gao; Chee Lip Gan (3DIC, 2011)

Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending. - Hongbin Shi; Fa Xing Che; Toshitsugu Ueda (Microelectron. Reliab., 2011)

Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. - Dhafer Abdulameer Shnawah; Suhana Binti Mohd Said; Mohd Faizul Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che (Microelectron. Reliab., 2012)

Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. - Fa Xing Che; Xiaowu Zhang; Jong-Kai Lin (Microelectron. Reliab., 2016)