Developing digital test sequences for through-silicon vias within 3D structures. - Matthias Gulbins; Fabian Hopsch; Peter Schneider; Bernd Straube; Wolfgang Vermeiren (3DIC, 2010)

Characterization of digital cells for statistical test. - Fabian Hopsch; Michael Lindig; Bernd Straube; Wolfgang Vermeiren (DDECS, 2011)

Variation-aware fault modeling. - Fabian Hopsch; Bernd Becker 001; Sybille Hellebrand; Ilia Polian; Bernd Straube; Wolfgang Vermeiren; Hans-Joachim Wunderlich (Sci. China Inf. Sci., 2011)

Guest Editors' Introduction: Robust 3-D Stacked ICs. - S. Saqib Khursheed; Pascal Vivet; Fabian Hopsch; Erik Jan Marinissen (IEEE Des. Test, 2016)