Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects. - Takeshi Nogami; Oleg Gluschenkov; Yasir Sulehria; Son Nguyen; Brown Peethala; Huai Huang; Hosadurga Shobha; Nick A. Lanzillo; Raghuveer Patlolla; Devika Sil; Andrew Simon; Daniel Edelstein; et al. (VLSI Technology and Circuits, 2022)