3D monolithic integration. - Perrine Batude; Maud Vinet; Arnaud Pouydebasque; Cyrille Le Royer; Bernard Previtali; Claude Tabone; Jean-Michel Hartmann; Loic Sanchez; Laurence Baud; Veronique Carron; Alain Toffoli; Fabienne Allain; et al. (ISCAS, 2011)

Ultra-Thin Body and Buried Oxide (UTBB) FDSOI Technology with Low Variability and Power Management Capability for 22 nm Node and Below. - J. Mazurier; Olivier Weber; François Andrieu; Alain Toffoli; Olivier Thomas; Fabienne Allain; Jean-Philippe Noel; Marc Belleville; Olivier Faynot; T. Poiroux (J. Low Power Electron., 2012)