A 0.36 mm2 On-the-Fly I2C-to-SPI Converter for E-Textile Applications. - Omar Faruqe; Zhenghong Chen; Suprio Bhattacharya; Md. Fahim Foysal; Samit Hasan; Daniel S. Truesdell; Benton H. Calhoun (ISCAS, 2025)

37.2 A 2-Dimensional mm-Scale Network-on-Textiles (kNOTs) for Wearable Computing with Direct Die-to-Yarn Integration of 0.6×2.15mm2 SoC and bySPI Chiplets. - Anjali Agrawal; Zhenghong Chen; Braden E. Desman; Jinhua Wang 007; Akiyoshi Tanaka; Fahim Foysal; Charlie D. Hess; Will Farrell; Jim Owens; Daniel S. Truesdell; Benton H. Calhoun (ISSCC, 2025)