Identification and analysis of power substrates degradations subjected to severe aging tests. - Eric Woirgard; Faical Arabi; Wissam Sabbah; Donatien Martineau; L. Théolier; Stephane Azzopardi (Microelectron. Reliab., 2015)

Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices. - Faical Arabi; Loic Théolier; Donatien Martineau; Jean-Yves Delétage; M. Medina; Eric Woirgard (Microelectron. Reliab., 2016)

Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling. - Wissam Sabbah; Faical Arabi; Oriol Avino-Salvado; Cyril Buttay; L. Théolier; Hervé Morel (Microelectron. Reliab., 2017)

Sequential combined thermal cycling and vibration test and simulation of printed circuit board. - Faical Arabi; Alexandrine Guédon-Gracia; Jean-Yves Delétage; Hélène Frémont (Microelectron. Reliab., 2018)