Improved GrabCut for Human Brain Computerized Tomography Image Segmentation. - Zhihua Ji; Shaode Yu; Shibin Wu; Yaoqin Xie; Fashun Yang (HIS, 2016)

Analytical model of internal heat transfer of a power chip with through silicon via. - Jingyu Liu; Yongyong Wang; Xunyong Yang; Fashun Yang; Kui Ma (ASICON, 2017)

Linear current module adaptive to wide operating voltage range based on automatic series/parallel conversion. - Kui Ma; Zhuang Wang; Fashun Yang (IEICE Electron. Express, 2020)

Advanced motor driving circuit with improved transfer efficiency based on adaptive segmented control. - Kui Ma; Kaiying Xu; Fashun Yang; Jiexin Lin (IEICE Electron. Express, 2021)

Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips. - Rui Hu; Mengru Huang; Linhong Lu; Fashun Yang; Jiexin Lin; Kui Ma; Zhao Ding (IEICE Electron. Express, 2024)

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias. - Rui Hu; Linhong Lu; Zhongchen Bai; Fashun Yang; Kui Ma; Zhao Ding (IEICE Electron. Express, 2024)

Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array. - Linhong Lu; Xinghua Fu; Rui Hu; Fashun Yang; Jiexin Lin; Zhongchen Bai; Kui Ma (Microelectron. J., 2024)