Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. - Fei Chong Ng; Aizat Abas; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; M. S. Abdul Aziz (Microelectron. Reliab., 2016)

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. - Fei Chong Ng; Aizat Abas; Z. L. Gan; Mohd Zulkifly Abdullah; F. Che Ani; M. Yusuf Tura Ali (Microelectron. Reliab., 2017)

Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. - Fei Chong Ng; Aizat Abas; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2018)