A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration. - Xiping Jiang; Fengguo Zuo; Song Wang; Xiaofeng Zhou; Bing Yu; Yubing Wang; Qi Liu; Ming Liu; Yi Kang; Qiwei Ren (A-SSCC, 2021)

184QPS/W 64Mb/mm23D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System. - Dimin Niu; Shuangchen Li; Yuhao Wang 002; Wei Han; Zhe Zhang 006; Yijin Guan; Tianchan Guan; Fei Sun; Fei Xue; Lide Duan; Yuanwei Fang; Hongzhong Zheng; et al. (ISSCC, 2022)

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV. - Song Wang; Bing Yu; Wenwu Xiao; Fujun Bai; Xiaodong Long; Liang Bai; Xuerong Jia; Fengguo Zuo; Jie Tan; Yixin Guo; Peng Sun; Jun Zhou; et al. (VLSI Technology and Circuits, 2023)