Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration. - Fengjiang Wang; Dongyang Li; Shuang Tian; Zhijie Zhang; Jiheng Wang; Chao Yan (Microelectron. Reliab., 2017)

CHEABC-QCRP: A novel QoS-aware cluster routing protocol for industrial IoT. - Fengjiang Wang; Chuchu Rao; Xiaosheng Fang; Yeshen Lan (Simul. Model. Pract. Theory, 2024)