A Facial Sketch Animation Generator for Mobile Communication. - Yuehu Liu; Yuanqi Su; Yang Yang 066; Fengjuan Wang; Maojun Yuan; Zhen Ren (MVA, 2007)

A thermal model for the top layer of 3D integrated circuits considering through silicon vias. - Fengjuan Wang; Zhangming Zhu; Yintang Yang; Ning Wang (ASICON, 2011)

Is Internal Capital Market of China Listed Companies Efficient? - Empirical Evidences from Listed Companies Which Have Multiple Divisions in H-stock. - Fengjuan Wang; Zhihua Xie (ICEIS (4), 2011)

Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. - Xiaoxian Liu; Zhangming Zhu; Yintang Yang; Fengjuan Wang; Ruixue Ding (IEICE Electron. Express, 2013)

Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). - Fengjuan Wang; Zhangming Zhu; Yintang Yang; Xiaoxian Liu; Ruixue Ding (IEICE Electron. Express, 2013)

Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV). - Fengjuan Wang; Zhangming Zhu; Yintang Yang; Xiaoxian Liu; Ruixue Ding (IEICE Electron. Express, 2013)

Effect of Inertia Weight w on PSO-SA Algorithm. - Shigang Wang; Fangfang Zhou; Fengjuan Wang (Int. J. Online Biomed. Eng., 2013)

Capacitance characterization of tapered through-silicon-via considering MOS effect. - Fengjuan Wang; Zhangming Zhu; Yintang Yang; Xiaoxian Liu; Ruixue Ding (Microelectron. J., 2014)

Parallel Implementation of P Systems for Data Clustering on GPU. - Jie Jin; Hui Liu; Fengjuan Wang; Hong Peng 001; Jun Wang 013 (BIC-TA, 2015)

Study on thermal stress and keep-out zone induced by Cu and SiO2 filled coaxial-annular through-silicon via. - Fengjuan Wang; Ningmei Yu (IEICE Electron. Express, 2015)

Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. - Fengjuan Wang; Ningmei Yu; Zhangming Zhu; Xiangkun Yin; Yintang Yang (IEICE Electron. Express, 2015)

Based on reverse molding technology of the impeller of the fluid dynamics analysis. - Shigang Wang; Yong Yan; Fengjuan Wang; Guanxiong Wu (J. Comput. Methods Sci. Eng., 2015)

Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC). - Fengjuan Wang; Ningmei Yu (IEICE Electron. Express, 2016)

Explicit model of thermal stress induced by annular through-silicon-via (TSV). - Fengjuan Wang; Ningmei Yu (IEICE Electron. Express, 2016)

Data Munging Tricks Can Build Better High Risk Maternity Predictive Models. - Andrew Placona; Fengjuan Wang; Shantanu Phatakwala; Nick Toure (AMIA, 2017)

Equivalent circuit model of through-silicon-via in slow wave mode. - Fengjuan Wang; Gang Wang; Ningmei Yu (IEICE Electron. Express, 2017)

An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias. - Fengjuan Wang; Ningmei Yu (IEEE Trans. Very Large Scale Integr. Syst., 2017)

Longitudinal Clustering of High Cost Patients' Spend Trajectories: Delineating Individual Behaviors from Aggregate Trends. - Andrew Placona; Fengjuan Wang; Rich King (AMIA, 2018)

Mode locking and quasiperiodicity in a discrete-time Chialvo neuron model. - Fengjuan Wang; Hongjun Cao (Commun. Nonlinear Sci. Numer. Simul., 2018)

A novel guard method of through-silicon-via (TSV). - Fengjuan Wang; Jia Huang; Ningmei Yu (IEICE Electron. Express, 2018)

A Multispectral Image Edge Detection Algorithm Based on Improved Canny Operator. - Baoju Zhang; Fengjuan Wang; Gang Li 002; Cuiping Zhang; Chengcheng Zhang (CSPS, 2019)

Single-Channel Grayscale Processing Algorithm for Transmission Tissue Images Based on Heterogeneity Detection. - Baoju Zhang; Chengcheng Zhang; Gang Li 002; Ling Lin 003; Cuiping Zhang; Fengjuan Wang (CSPS, 2019)

Multispectral Heterogeneity Detection Based on Frame Accumulation and Deep Learning. - Baoju Zhang; Chengcheng Zhang; Gang Li 002; Ling Lin 003; Cuiping Zhang; Fengjuan Wang; Wenrui Yan (IEEE Access, 2019)

A Preprocessing Algorithm Based on Heterogeneity Detection for Transmitted Tissue Image. - Chengcheng Zhang; Baoju Zhang; Gang Li 002; Ling Lin 003; Cuiping Zhang; Fengjuan Wang (EURASIP J. Wirel. Commun. Netw., 2019)

A high-pass filter based on through-silicon via (TSV). - Fengjuan Wang; Jia Huang; Ningmei Yu (IEICE Electron. Express, 2019)

Investigation on impact of substrate on low-pass filter based on coaxial TSV. - Fengjuan Wang; He Li; Ningmei Yu (IEICE Electron. Express, 2019)

Fiber Ring Laser Directional Torsion Sensor with Ultra-Wide Linear Response. - Xianjin Liu; Fengjuan Wang; Jiuru Yang; Xudong Zhang; Xiliang Du (Sensors, 2019)

Study on the Application of an Improved Intelligent Group Algorithm. - Fengjuan Wang (Intell. Autom. Soft Comput., 2020)

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications. - Fengjuan Wang; Lei Ke; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (IEEE Access, 2021)

Low-light image joint enhancement optimization algorithm based on frame accumulation and multi-scale Retinex. - Fengjuan Wang; Baoju Zhang; Cuiping Zhang; Wenrui Yan; Zhiyang Zhao; Man Wang (Ad Hoc Networks, 2021)

A novel optimization method for WSN based on mixed matrix decomposition of NMF and 2-SVD-QR. - Zhiyang Zhao; Baoju Zhang; Bo Zhang 033; Cuiping Zhang; Man Wang; Wenrui Yan; Fengjuan Wang (Ad Hoc Networks, 2021)

TSV-based hairpin bandpass filter for 6G mobile communication applications. - Fengjuan Wang; Lei Ke; Xiangkun Yin; Vasilis F. Pavlidis; Ningmei Yu; Yuan Yang 006 (IEICE Electron. Express, 2021)

Analytical models of AC inductance and quality factor for TSV-based inductor. - Xiangkun Yin; Fengjuan Wang (IEICE Electron. Express, 2021)

A transformer with high coupling coefficient and small area based on TSV. - Fengjuan Wang; Ruinan Ren; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (Integr., 2021)

Design of compact LC lowpass filters based on coaxial through-silicon vias array. - Xiangkun Yin; Fengjuan Wang; Vasilis F. Pavlidis; Xiaoxian Liu; Qijun Lu; Tao Zhang 086; Yang Liu 106 (Microelectron. J., 2021)

TSV-based SIW bandpass filter for W-band mobile communication applications. - Fengjuan Wang; Quan Peng; Ningmei Yu; Yuan Yang (IEICE Electron. Express, 2022)

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line. - Fengjuan Wang; Sa Xiao; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (IEICE Electron. Express, 2022)

Wideband transmission optimization for heterogenous interconnection in 3D IC. - Xiangkun Yin; Jingyu Lu; Fengjuan Wang (IEICE Electron. Express, 2022)

Compact high-performance dual-frequency power divider based on TSV. - Fengjuan Wang; Ruiqi Li; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (Microelectron. J., 2022)

Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application. - Xiangkun Yin; Jingyu Lu; Fengjuan Wang (Microelectron. J., 2022)

A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application. - Fengjuan Wang; Kai Zhang; Xiangkun Yin; Ningmei Yu; Yuan Yang 006 (IEEE Trans. Very Large Scale Integr. Syst., 2022)

TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. - Fengjuan Wang; Zhuoyu Yang; Xiangkun Yin; Ningmei Yu; Yuan Yang (IEICE Electron. Express, 2023)

Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. - Fengjuan Wang; Ying Lu; Xiangkun Yin; Jiangfan Liu; Ningmei Yu; Yuan Yang 006 (Microelectron. J., 2023)

Synergetic Prototype Learning Network for Unbiased Scene Graph Generation. - Ruonan Zhang; Ziwei Shang; Fengjuan Wang; Zhaoqilin Yang; Shan Cao; Yigang Cen; Gaoyun An (ACM Multimedia, 2024)

Credit risk prediction based on an interpretable three-way decision method: Evidence from Chinese SMEs. - Meng Pang; Fengjuan Wang; Zhe Li 047 (Appl. Soft Comput., 2024)

EPK-CLIP: External and Priori Knowledge CLIP for action recognition. - Zhaoqilin Yang; Gaoyun An; Zhenxing Zheng; Shan Cao; Fengjuan Wang (Expert Syst. Appl., 2024)

Effect of annealing residual stress on mobility of TSV vertical switch. - Fengjuan Wang; Jiashuo Ren; Xiangkun Yin; Ningmei Yu; Yuan Yang 006; Kai Jing; Qian Li (IEICE Electron. Express, 2024)

A compact fifth-order SIW BPF based on TSV technology with high selectivity. - Fengjuan Wang; Jilin Kou; Xiangkun Yin; Jiangfan Liu; Kai Jing; Ningmei Yu; Yuan Yang 006; Qian Li (Microelectron. J., 2024)

A 3.5 ppm/°C Novel Curvature-Compensated Bandgap Reference Using Four-Input Current Feedback Amplifier with 3σ Inaccuracy of ±0.05%. - Kai Jing; Yangpeng Jia; Ronghui Liu; Fengjuan Wang; Yuan Yang 006 (ISCAS, 2025)

VCF: An effective Vision-Centric Framework for Visual Question Answering. - Fengjuan Wang; Longkun Peng; Shan Cao; Zhaoqilin Yang; Ruonan Zhang; Gaoyun An (Neurocomputing, 2025)