Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. - Fenglian Sun; Hendrik Pieter Hochstenbach; Willem D. van Driel; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2008)

Thermal and mechanical effects of voids within flip chip soldering in LED packages. - Yang Liu 103; Stanley Y. Y. Leung; Jia Zhao; Cell K. Y. Wong; Cadmus A. Yuan; Guoqi Zhang; Fenglian Sun; Liangliang Luo (Microelectron. Reliab., 2014)

Evaluating board level solder interconnects reliability using vibration test methods. - Yang Liu 103; Fenglian Sun; Hongwu Zhang; J. Wang; Zhen Zhou (Microelectron. Reliab., 2014)

Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. - Yang Liu 103; Fenglian Sun; Hao Zhang 034; Tong Xin; Cadmus A. Yuan; Guoqi Zhang (Microelectron. Reliab., 2015)

A new hermetic sealing method for ceramic package using nanosilver sintering technology. - Hao Zhang 034; Yang Liu 103; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; Guoqi Zhang (Microelectron. Reliab., 2018)