Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate. - Peng Wu; Fengze Hou; Cheng Chen; Jun Li 104; Fengman Liu; Jing Zhang; Liqiang Cao; Lixi Wan (Microelectron. Reliab., 2016)

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate. - Cheng Chen; Fengze Hou; Fengman Liu; Qian She; Liqiang Cao; Lixi Wan (Microelectron. Reliab., 2017)

Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects. - Jian He; Donglai Lu; Haiyun Xue; Sikai Chen; Han Liu; Leliang Li; Guike Li; Zhao Zhang 004; Jian Liu 021; Liyuan Liu; Nanjian Wu; Ningmei Yu; et al. (IEEE Trans. Circuits Syst. I Regul. Pap., 2022)

A 2T P-Channel Logic Flash Cell for Reconfigurable Interconnection in Chiplet-Based Computing-In-Memory Accelerators. - Weizeng Li; Linfang Wang; Zhi Li 062; Wang Ye; Zhidao Zhou; Haiyang Zhou; Hanghang Gao; Jinshan Yue; Hongyang Hu; Fengman Liu; Qing Luo; Chunmeng Dou (ISCAS, 2024)

PDN analysis of 3D chiplet integration with a DC-DC converter on active interposer. - Chengyi Liao; Huimin He; Fengze Hou; Cheng Peng; Fengman Liu; Liqiang Cao (IEICE Electron. Express, 2025)

Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures. - Yunting Liu; Rong Fu; Meiying Su; Jun Li; Chuan Chen; Fengman Liu (Microelectron. J., 2025)