Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints. - Tianwei Hu; Yi Li; Yan-Cheong Chan; Fengshun Wu (Microelectron. Reliab., 2015)

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing. - Ze Zhu; Yan-Cheong Chan; Fengshun Wu (Microelectron. Reliab., 2018)