Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate. - Peng Wu; Fengze Hou; Cheng Chen; Jun Li 104; Fengman Liu; Jing Zhang; Liqiang Cao; Lixi Wan (Microelectron. Reliab., 2016)

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate. - Cheng Chen; Fengze Hou; Fengman Liu; Qian She; Liqiang Cao; Lixi Wan (Microelectron. Reliab., 2017)

Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling. - Delong Qiu; Liqiang Cao; Qidong Wang; Fengze Hou; Xugang Wang (Microelectron. Reliab., 2017)

PDN analysis of 3D chiplet integration with a DC-DC converter on active interposer. - Chengyi Liao; Huimin He; Fengze Hou; Cheng Peng; Fengman Liu; Liqiang Cao (IEICE Electron. Express, 2025)