Multi-Partner Project: COIN-3D - Collaborative Innovation in 3D VLSI Reliability. - George Rafael Gourdoumanis; Fotoini Oikonomou; Maria Pantazi-Kypraiou; Pavlos Stoikos; Olympia Axelou; Athanasios Tziouvaras; Georgios Karakonstantis; Tahani Aladwani; Christos Anagnostopoulos 001; Yixian Shen; Anuj Pathania; Alberto García Ortiz; et al. (DATE, 2026)