Avoiding misleading artefacts in metallurgical preparation of die attach solder joints in high power modules. - Franc Dugal; Mauro Ciappa (Microelectron. Reliab., 2013)

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules. - Franc Dugal; Mauro Ciappa (Microelectron. Reliab., 2014)

Reliability investigation of the copper-zinc system for solid diffusion bonding in power modules. - Franc Dugal; Mauro Ciappa (Microelectron. Reliab., 2017)