Electrical analysis on implantation-related defect by nanoprobing methodology. - Changqing Chen; P. T. Ng; Ghinboon Ang; H. Tan; Francis Rivai; Y. Z. Ma; Huipeng Ng; Jeffrey Lam; Zhihong Mai (Microelectron. Reliab., 2016)

Cross-sectional nanoprobing fault isolation technique on submicron devices. - Pik Kee Tan; Huei Hao Yap; Changqing Chen; Francis Rivai; Yuzhe Zhao; Lei Zhu; Hua Feng; Hao Tan; Ran He; D. D. Wang; Y. M. Huang; Yin Zhe Ma; et al. (Microelectron. Reliab., 2016)

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system. - Yuzhe Zhao; Q. J. Wang; Pik Kee Tan; Huei Hao Yap; Binghai Liu; H. Feng; Hao Tan; Ran He; Y. M. Huang; D. D. Wang; Lei Zhu; C. Q. Chen; et al. (Microelectron. Reliab., 2016)

Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern. - Changqing Chen; Ghim Boon Ang; Peng Tiong Ng; Francis Rivai; Soh Ping Neo; Dayanand Nagalingam; Kim Hong Yip; Jeffery Lam; Zhihong Mai (Microelectron. Reliab., 2017)

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis. - Changqing Chen; Ghim Boon Ang; Peng Tiong Ng; Francis Rivai; Hui Peng Ng; Alfred C. T. Quah; Angela Teo; Jeffery Lam; Zhihong Mai (Microelectron. Reliab., 2017)

Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique. - Pik Kee Tan; Yuzhe Zhao; Francis Rivai; Binghai Liu; Yanlin Pan; Ran He; Hao Tan; Zhihong Mai (Microelectron. Reliab., 2018)