A power, packaging, and cooling overview of the IBM eServer z900. - Prabjit Singh; Steven J. Ahladas; Wiren Dale Becker; Frank E. Bosco; Joseph P. Corrado; Gary F. Goth; Sushumna Iruvanti; Matthew A. Nobile; Budy D. Notohardjono; John H. Quick; Edward J. Seminaro; Kwok M. Soohoo; et al. (IBM J. Res. Dev., 2002)

Packaging the IBM eServer z990 central electronic complex. - Juan C. Parrilla; Frank E. Bosco; John S. Corbin; John J. Loparco; Prabjit Singh; John G. Torok (IBM J. Res. Dev., 2004)

Packaging design of the IBM System z10 Enterprise Class platform central electronic complex. - John G. Torok; Frank E. Bosco; W. L. Brodsky; E. F. Furey; Gary F. Goth; Daniel J. Kearney; John J. Loparco; M. T. Peets; K. L. Pizzolato; Donald W. Porter; G. Ruehle; W. H. White (IBM J. Res. Dev., 2009)

IBM zEnterprise energy management. - Michael Andres; Andreas Bieswanger; Frank E. Bosco; Gary F. Goth; Hannes Hering; William P. Kostenko; Thomas B. Mathias; Thomas Pohl; Huajun Wen (IBM J. Res. Dev., 2012)

Overview of IBM zEnterprise 196 I/O subsystem with focus on new PCI Express infrastructure. - Thomas A. Gregg; David Craddock; Daniel J. Stigliani; Frank E. Bosco; E. E. Cruz; Michael F. Scanlon; Philip A. Sciuto; G. Bayer; M. Jung; Christoph Raisch (IBM J. Res. Dev., 2012)

Electronic packaging of the IBM System z196 enterprise-class server processor cage. - Thomas Strach; Frank E. Bosco; Kenneth L. Christian; Kevin R. Covi; Martin Eckert; Gregory R. Edlund; Roland Frech; Hubert Harrer; Andreas Huber; Dierk Kaller; Martin Kindscher; A. Z. Muszynski; et al. (IBM J. Res. Dev., 2012)

Mechanical packaging, power, and cooling design for the IBM z13. - John G. Torok; Frank E. Bosco; Gary F. Goth; John J. Loparco; M. T. Peets; Donald W. Porter; S. G. Shevach; B. C. Tucker; A. C. VanDeventer; X. Wei; P. A. Wendling; Y. Yu; et al. (IBM J. Res. Dev., 2015)