Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (3DIC, 2019)

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. - Amadine Jouve; Loïc Sanchez; Clément Castan; Nicolas Bresson; Frank Fournel; Nicolas Raynaud; Pascal Metzger (3DIC, 2019)

Laser Array Covering 155 nm Wide Spectral Band Achieved by Selective Area Growth on Silicon Wafer. - C. Besancon; Pierre Fanneau; Delphine Néel; Giancarlo Cerulo; Nicolas Vaissiere; Dalila Make; Frédéric Pommereau; Frank Fournel; Cécilia Dupré; T. Baron; Jean Decobert (ECOC, 2020)

AlGaInAs MQW Laser Regrowth on Heterogenerous InP-on-SOI: Performance for Different Silicon Cavity Designs. - Claire Besancon; Delphine Néel; Joan Ramirez; David Bitauld; Giancarlo Cerulo; Dalila Make; Nicolas Vaissiere; Frédéric Pommereau; Frank Fournel; Loic Sanchez; Cécilia Dupré; Viviane Muffato; et al. (OFC, 2021)